| 发明名称 |
CAMERA MODULE AND ITS MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a camera module which is small-sized by forming a resin bump by effectively utilizing an area on the bottom face (mounting side face) of the camera module. <P>SOLUTION: The camera module 40 includes: projections formed on the mounting side face of a molding 12; a metal film 15 constituting an external connecting terminal in cooperation with the projections; a semiconductor device 14 buried in the molding; an imaging device 13 facing an imaging lens 11 through an aperture of the molding; and a wiring board 19 with the molding mounted thereon. The projections include a first projection 12a positioned around the semiconductor device 14 and a second projection 42a formed on the mounting side face within a semiconductor device packaging area. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2006180523(A) |
申请公布日期 |
2006.07.06 |
| 申请号 |
JP20050375679 |
申请日期 |
2005.12.27 |
| 申请人 |
FUJITSU LTD |
发明人 |
ONODERA MASANORI;MORIYA SUSUMU;KOBAYASHI IZUMI;AOKI HIROSHI;YODA TOSHIYUKI |
| 分类号 |
H01L23/12;H01L23/28;H01L27/14;H04N5/225;H04N5/335 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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