| 摘要 |
PROBLEM TO BE SOLVED: To provide a slurry of ultrafine copper powder for forming a wiring section having finer intervals on a substrate when used for electroconductive ink or electroconductive paste for electric wiring. SOLUTION: The ultrafine copper powder has characteristics such as a D<SB>TEM</SB>(μm) of 0.01 to 0.1, a D<SB>50</SB>/D<SB>TEM</SB>of 1.0 to 1.5, and a ratio of a crystal particle diameter to the D<SB>TEM</SB>of 0.2 to 1, (wherein D<SB>TEM</SB>represents an average primary particle diameter which is determined by measuring the particle diameter through a photograph of a TEM image and dividing the measured diameter by the observation magnification; and D<SB>50</SB>represents a 50% volume accumulative particle diameter measured with a Doppler scattering light analytical method). The slurry is produced by suspending the ultrafine copper powder in a solvent. COPYRIGHT: (C)2006,JPO&NCIPI |
