发明名称 |
SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND FABRICATION METHOD OF THEM, AND TV APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a display device which are fabricated with improved use efficiency and in a simplified fabrication process and a technique for the fabrication, and to provide a technique of forming patterns of wiring for configuring the semiconductor device and the display device with high adhesiveness in a desired form. SOLUTION: A conductive porus buffer layer is formed between first and second buffer layers, thereby improving adhesiveness between the first and second buffer layers. Granular conductive material is filled into holes of the porus buffer layer, and sintered to be solidified, thereby forming the second conductive layer. The conductive layer solidified in the holes functions like a wedge, which helps stable formation of the second conductive layer with high adhesiveness to the first conductive layer. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006179880(A) |
申请公布日期 |
2006.07.06 |
申请号 |
JP20050338507 |
申请日期 |
2005.11.24 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
FUJII ITSUKI;MORISUE MASAFUMI |
分类号 |
H01L29/786;G02F1/1368;H01L21/288;H01L21/3205;H01L29/417 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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地址 |
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