发明名称 Solid-state imaging device and method for making the same
摘要 A solid-state imaging device includes a semiconductor substrate, one or more wiring interlayer films disposed on or above the semiconductor substrate, and one or more metal wires embedded in the wiring interlayer films. The one or more wiring interlayer films are composed of a diffusion preventing material that prevents the diffusion of the metal wire.
申请公布号 US2006145346(A1) 申请公布日期 2006.07.06
申请号 US20050298771 申请日期 2005.12.09
申请人 TAKEDA TAKESHI 发明人 TAKEDA TAKESHI
分类号 H01L23/52;H01L21/768;H01L23/522;H01L27/14;H04N5/335;H04N5/369 主分类号 H01L23/52
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