发明名称 |
Method for manufacturing semiconductor device having a pair of heat sinks |
摘要 |
A semiconductor device includes a heater element; a first heat sink disposed on one side of the heater element; a second heat sink disposed on the other side of the heater element; and a resin mold for molding the heater element and the first and second heat sinks. The first heat sink includes a first heat radiation surface, which is disposed opposite to the heater element and exposed from the resin mold. The second heat sink includes a second heat radiation surface, which is disposed opposite to the heater element and exposed from the resin mold. The first and second heat radiation surfaces have a degree of parallelism therebetween equal to or smaller than 0.2 mm. |
申请公布号 |
US2006145335(A1) |
申请公布日期 |
2006.07.06 |
申请号 |
US20060365674 |
申请日期 |
2006.03.02 |
申请人 |
DENSO CORPORATION |
发明人 |
TESHIMA TAKANORI;NAKAZAWA SHUSAKU |
分类号 |
H01L23/29;H01L23/34;H01L21/48;H01L23/433;H01L25/07 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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