SEMICONDUCTOR POWER MODULE

摘要

PROBLEM TO BE SOLVED: To improve thermal fatigue life and moisture resistance of a solder connection part of a resin sealed semiconductor power module.

SOLUTION: In the semiconductor power module, a Si chip is mounted on an insulating substrate where high grade Al or Al alloy is directly brought into contact with a ceramic substrate so as to bond them through solder. The Si chip and the insulating substrate are sealed with epoxy resin whose coefficient of linear expansion is 10×10-6to 40×10-6/°C, whose Young's modulus is 3 to 20 GPa and whose glass transition temperature Tg is 150°C or above.

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