| 摘要 |
PROBLEM TO BE SOLVED: To easily prevent electric connection failure of a lead to a physical quantity sensor chip, in a manufacturing method of a physical quantity sensor. SOLUTION: The lead frame is formed of a metal thin plate having stage sections 7 and 9 for supporting physical quantity sensor chips on their surfaces, a frame section having the leads 17 and 19 arranged around the stage sections, and a connecting section 13 for connecting the stage sections 7 and 9 to the frame section. The base ends 17b of the leads 17 separated from the stage sections 7 and 9 are arranged on substantially the same plane, the stage sections 7 and 9 are arranged tiltingly with respect to the same plane, and surfaces 17c of the tips 17a of the plurality of leads 17 located on the stage section 7 and 9 side are arranged along the surfaces 7a and 9a of the stage sections 7 and 9. COPYRIGHT: (C)2006,JPO&NCIPI
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