发明名称 |
SEMICONDUCTOR STRUCTURES UTILIZING THIN FILM RESISTORS AND TUNGSTEN PLUG CONNECTORS AND METHODS FOR MAKING THE SAME |
摘要 |
Semiconductor structures and methods for fabricating semiconductor structures are provided. The method comprises forming a first insulating layer having a substantially planar surface overlying a first conductive layer of an interconnect stack. A thin film resistor is formed overlying the first insulating layer and a second insulating layer is deposited overlying the first insulating layer and the resistor. A portion of the second insulating layer is removed to form a substantially planar surface. The second insulating layer is anisotropically etched to form a first via to the first conductive layer and a fill material comprising tungsten is deposited within the first via. The second insulating layer is wet etched to form a second via to the thin film resistor and a second conductive layer is deposited overlying the second insulating layer and within the second via. |
申请公布号 |
WO2006071617(A2) |
申请公布日期 |
2006.07.06 |
申请号 |
WO2005US46056 |
申请日期 |
2005.12.20 |
申请人 |
MEDTRONIC, INC.;DANZL, RALPH, B. |
发明人 |
DANZL, RALPH, B. |
分类号 |
H01L23/522;H01L21/768 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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