PACKAGING FOR ELECTRONIC MODULES

摘要

An electronic module has a non-conducting substrate (302) having at least one opening (304) and a die/carrier assembly (306) mounted within the opening in the substrate. The assembly has a conducting carrier (408) and one or more integrated circuit (IC) dies (402) mounted to the carrier. The invention may be implemented as an electronic system comprising a circuit board (CB) and at least one such electronic module mounted to the CB.