| 摘要 |
<p>The invention concerns a double-sided electronic module for a contact/non-contact hybrid smart card adapted to be urged to be bonded into a cavity of the card and connected to the bond pads of the antenna embedded in the card, the module comprising on the first side of the support a contact pad (52), some of the contacts covering each a hole running through the support. In accordance with one main feature of the invention, on the second side of the module are screen-printed first strip conductors (54) connected through their first ends (55) to the through holes and through their other ends to bond pads of the chip and second strip conductors (56 and 58) connected each respectively on one side to a screen-printed bond pad (57 and 59) and on the other to two of the bond pads of the chip, the bond pads being positioned such that when the module is inserted into the cavity, they are opposite the antenna bond pads and enable the module to be bonded over its entire periphery.</p> |
