BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE

摘要

A benzoxazole resin precursor comprising first repeating units obtained by reacting two compounds, i.e., a bisaminophenol compound and a dicarboxylic acid compound, at least one of which has a diamondoid structure. A benzoxazole resin precursor comprising second repeating units obtained by reacting a bisaminophenol compound not having a diamondoid structure with a dicarboxylic acid compound not having a diamondoid structure. A polybenzoxazole resin produced by a dehydroring-closing reaction of the benzoxazole resin precursor. A resin film formed of the benzoxazole resin precursor or polybenzoxazole resin. A heat-resistant and low-permittivity polybenzoxazole resin, a resin film, and a semiconductor device using the same are produced from the benzoxazole resin precursor.