| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the air bulge and surge of an adhered card base material due to gas to be generated in hardening adhesive, and to improve smoothness and printing performance. <P>SOLUTION: This card manufacturing method is provided to apply adhesive to at least one portion of the periphery of an inlet 3 having an IC chip, and to coat a first sheet material 1 and a second sheet material holding the inlet 3 from the both sides with the adhesive by a coating head, and by using the coating head wherein the value of the slit gap of the coating head for coating the section where the inlet 3 does not exist is larger than the value of the slit gap of the coating head for coating the section where the inlet 3 exists. Then, adhesion is carried out by a laminate roller wherein the diameter of the laminate roller which is equivalent to the section where the inlet does not exist is larger than the diameter of the laminate roller in the section where the inlet exists. The boundary section of the section where the inlet does not exist and the section where the inlet exists in an adhered card base material is pressurized, so that adhesion is carried out. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
