| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for packaging semiconductor devices that maintains a distance between a semiconductor device and a circuit board to be longer than a predetermined one in order to prevent the filler included in a heat-hardening resin from causing cracks in the semiconductor device. SOLUTION: After interposing a heat-hardening resin 3 between a stand bump 5 formed on the electrode of a semiconductor device 4 and a wiring 2 on a circuit diagram 1, inserting the semiconductor 4, and adjusting the positions of the stand bump 5 and the wiring 2; this method employs a clamping tool 8 to interpose a protection tape 7 employing a material with a higher elastic modulus than that of a fluorocarbon resin between the semiconductor devices 4, and electrically connects the semiconductor devices 4 and the circuit board 2 through thermocompression. COPYRIGHT: (C)2006,JPO&NCIPI |
