| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-polyimide substrate which has high adhesive strength after heat treatment in a fine wiring pattern (8-50μm) and high reliability and can correspond to a wide range of an electronic part requiring a fine wiring pattern such as FPC, TAB, COF, IC, LSI and the like. SOLUTION: The metal-polyimide substrate is a laminated sheet constituted by providing a metal layer, which is formed by a sputtering method, or the metal layer formed on a metal layer, which is formed by the sputtering method, by an electroplating method, at least on one side of a polyimide layer. When the metal layer is processed so as to have a width of 8-50μm and the peel strength thereof is measured, the initial adhesive strength between the polyimide layer and the metal layer is 450 N/m or above and the adhesive strength after heat treatment between the polyimide layer and the metal layer after heat-treated in the atmosphere at 150°C for 168 h is 80% or above of the initial adhesive strength and 400 N/m or above. COPYRIGHT: (C)2006,JPO&NCIPI |
