| 摘要 |
Structures and methods for holding heat sinks in contact with electronic devices are described herein. In one embodiment, an assembly for holding a heat sink in contact with an electronic device includes a coil spring in transverse compression. When transversely compressed, the coil spring presses the heat sink against the electronic device with a uniform, or at least approximately uniform, pressure that enables the heat sink to efficiently conduct heat away from the electronic device without damaging the device.
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