发明名称 Semiconductor package security features using thermochromatic inks and three-dimensional identification coding
摘要 Numerous embodiments of an apparatus and method for generating an identification feature are described. In one embodiment of the present invention, portions of an identification character printed with thermochromatic ink are distributed within a three-dimensional matrix of a multi-layer patch. The multi-layer patch may be disposed above a substrate.
申请公布号 US2006145324(A1) 申请公布日期 2006.07.06
申请号 US20060363962 申请日期 2006.02.27
申请人 BOYD PATRICK D 发明人 BOYD PATRICK D.
分类号 H01L23/02;H01L23/544;H01L23/58;H05K1/02 主分类号 H01L23/02
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