发明名称 |
CHEMICALLY AMPLIFIED PHOTORESIST COMPOUNDS INCLUDING PHOTOACID GENERATOR AND THERMOACID GENERATOR AND METHOD FOR FORMING FINE PATTERN OF SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
<p>A chemically-amplified photoresist composition includes a polymer resin, a photo acid generator (PAG), and a thermal acid generator (TAG), where a thermal deprotection temperature of the polymer resin is greater than an acid generation temperature of the TAG. The photoresist composition may be utilized in a photolithography process which includes subjecting a layer of the photoresist composition to photon exposure which causes the PAG to decompose into acid, subjecting the photon-exposed layer of the photo resist composition to a heat treatment which causes the TAG to decompose into acid, and subjecting the heat-treated layer of photoreist composition to a post-exposure bake (PEB) at a temperature which is greater than the temperature of the heat treatment.</p> |
申请公布号 |
KR20060079638(A) |
申请公布日期 |
2006.07.06 |
申请号 |
KR20050000085 |
申请日期 |
2005.01.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, SOOK;OH, MIN JEONG;LEE, SUK JOO |
分类号 |
G03F7/004 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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