| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a matching circuit with a wide consistency range, and to provide a method and a device for plasma processing. <P>SOLUTION: When performing plasma processing to a substrate 7 mounted on a substrate electrode 6 by generating plasma in the vacuum vessel 1 by supplying high-frequency power with a frequency of f= 100 MHz to an antenna 5 provided to be protruded in the vacuum vessel 1 by a high-frequency power supply 4 for antenna while maintaining the inside of the vacuum vessel 1 at a prescribed pressure by exhausting with a turbo-molecular pump 3 as an exhaust system while introducing prescribed gas from a gas supply system 2 into a vacuum vessel 1, the plasma processing method with the wide matching range can be realized by operating a copper plate in the matching circuit as an inductance. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
