| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element housing package that reduces reflection loss in a bonding wire and prevents an effect on an external electric circuit, and to provide a semiconductor device. SOLUTION: The semiconductor element housing package comprises a metal substrate 1 that has a semiconductor element S mounting part 1a on the center of the top face thereof, and a through hole 1b formed around the mounting part 1a from the top face to the bottom face; and a lead terminal 3 which is inserted through the through-hole 1b, is fixed via a sealing member 2 in such a way that at least a lower end thereof projects from the through hole 1b, and an upper end thereof is electrically connected to the electrode of the semiconductor element S. A conductive projection 7 is formed in a standing state along the upper end of the lead terminal 3 in connection with an earth potential near the through hole 1b on the top face of the metal substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI
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