| 摘要 |
A multi-chip package mounted memory card includes at least one multi-chip package mounted on a printed circuit board, and card connectors connected to electrode terminals on the multi-chip package via a wiring on the printed circuit board. The same or different types of multi-chip packages may be mounted on the memory card, and same or different types of semiconductor chips may be mounted on each multi-chip package. In the multi-chip package, input pins or output pins may be connected to the semiconductor chips such that they are shared by the semiconductor chips, or may be separately connected to the semiconductor chips. Also, the semiconductor chips in the multi-chip package may have separate power supply lines or may share a power supply line.
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