发明名称 |
Forming a substrate core with embedded capacitor and structures formed thereby |
摘要 |
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.
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申请公布号 |
US2006146476(A1) |
申请公布日期 |
2006.07.06 |
申请号 |
US20050218357 |
申请日期 |
2005.09.02 |
申请人 |
SRINIVASAN SRIRAM;GUZEK JOHN S;PALANDUZ CENGIZ A;PROKOFIEV VICTOR;AUERNHEIMER JOEL A |
发明人 |
SRINIVASAN SRIRAM;GUZEK JOHN S.;PALANDUZ CENGIZ A.;PROKOFIEV VICTOR;AUERNHEIMER JOEL A. |
分类号 |
H01G4/228 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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