| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a stain of a crystal in a semiconductor material caused, by soldering a semiconductor detector to a print circuit board. SOLUTION: A method is provided which comprises applying a conductive adhesive to the surface of the semiconductor material (step 1); attaching an electrode plate to the surface of the semiconductor material (step 2); subjecting a semi-finished radiation measurement apparatus to a first thermal treatment, in order to harden the adhesive (step 3); disposing the semiconductor detector on the print circuit board (step 4); heating them in an electric furnace (step 5), i.e., carrying out second thermal treatment, whereby the semiconductor detector is soldered with conductors on the print circuit board; and heating the radiation measurement apparatus at 130°C in the electric furnace (step 6), i.e., carrying out a third thermal treatment, wherein its preferable temperature exceeds 80°C but is not higher than 170°C. COPYRIGHT: (C)2006,JPO&NCIPI
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