发明名称 |
Device and method for on-die temperature measurement |
摘要 |
A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.
|
申请公布号 |
US2006149974(A1) |
申请公布日期 |
2006.07.06 |
申请号 |
US20040025140 |
申请日期 |
2004.12.30 |
申请人 |
ROTEM EFRAIM;HERMERDING JIM G;DISTEFANO ERIC;COOPER BARNES |
发明人 |
ROTEM EFRAIM;HERMERDING JIM G.;DISTEFANO ERIC;COOPER BARNES |
分类号 |
G06F1/26 |
主分类号 |
G06F1/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|