发明名称 Device and method for on-die temperature measurement
摘要 A system for measuring and managing thermal operations of a processor core on a semiconductor die using a sensor positioned in a hotspot of the processor core. A measured temperature reading is determined based upon a temperature sensed by the sensor. Interrupt signals and a software readable register indicating temperature information provide feedback about the thermal environment to the processor. Based upon the measured temperature reading, the interrupt signals direct the processor to modify operation.
申请公布号 US2006149974(A1) 申请公布日期 2006.07.06
申请号 US20040025140 申请日期 2004.12.30
申请人 ROTEM EFRAIM;HERMERDING JIM G;DISTEFANO ERIC;COOPER BARNES 发明人 ROTEM EFRAIM;HERMERDING JIM G.;DISTEFANO ERIC;COOPER BARNES
分类号 G06F1/26 主分类号 G06F1/26
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