发明名称 |
Method of manufacturing signal processing apparatus |
摘要 |
In a signal processing apparatus for transmitting or processing a signal, a substrate has a recessed portion in a surface of the substrate, a first interconnecting conductor is on the substrate, including at least the recessed portion of the substrate, and a dielectric support film is on the substrate opposite the recessed portion of the substrate with an air space sand between the dielectric support film and the substrate. A second interconnecting conductor is on a part of a surface of the dielectric support film. The apparatus has a simple structure and reduced transmission loss and can be made in a simple manufacturing process.
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申请公布号 |
US2006145789(A1) |
申请公布日期 |
2006.07.06 |
申请号 |
US20060360385 |
申请日期 |
2006.02.24 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YOSHIDA YUKIHISA;NISHINO TAMOTSU;SUEHIRO YOSHIYUKI;LEE SANGSEOK;MIYAGUCHI KENICHI;JIAO JIWEI |
分类号 |
H01P3/08;H05K1/02;H01F17/00;H01P1/203;H01P3/00;H01P5/18;H01P11/00 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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