发明名称 System and method for mounting electrical devices
摘要 In one embodiment an electronic device, such as an optical sensor, is attached to a substrate upon which wire logouts and, if desired, other components are constructed. A frame, or cover, is attached to the substrate surrounding the attached device. An aperture in the cover allows wireless signals to pass in or out of the cover.
申请公布号 US2006145178(A1) 申请公布日期 2006.07.06
申请号 US20050030022 申请日期 2005.01.06
申请人 MUN LEE S;SINGH GURBIR;JOON SEOW P 发明人 MUN LEE S.;SINGH GURBIR;JOON SEOW P.
分类号 H01L33/00 主分类号 H01L33/00
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