| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device where conduction performance which is proof against large current is secured without increasing bonding-manhour of electrode parts of a semiconductor chip and external terminals and the electrode parts of the semiconductor chip and the external terminals can be wiring-connected. <P>SOLUTION: The semiconductor device 3 is provided with the semiconductor chip 34, the external terminals 35a, 35b and 35c and wiring materials 36a, 36b and 36c which wiring-connect the electrode parts 34a, 34b and 34c of the semiconductor chip 34 and the external terminals 35a, 35b and 35c. Lead frames are used for the respective wiring materials 36a, 36b and 36c. One end part of each lead frames 36a, 36b and 36c is bonded to whole upper faces of the electrode parts 34a, 34b and 34c of the semiconductor chip 34. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
