| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for peeling off a film in which a wafer is prevented from being broken in the course of peeling off a surface-protecting film. SOLUTION: The device for peeling off a film capable of peeling off a film 3 attached to a first portion 121 inclusive of the periphery of a wafer 20 and a second portion 122 situated inward of the first portion is provided with displacing means 61, 62 for displacing the first or second portion, or both, relatively to each other, so that the film on the first portion of the wafer may be located higher than that on the second portion; a tape-reel-out means for reeling out a peeling tape 103 onto the film attached to the first and second portions; and a peeling means 146 for peeling the film off from the first and second portions of the wafer by moving the peeling means along the first portion, while reeling out the peeling tape from the tape-reel-out means and pressing the reeled-out peeling tape exclusively against the film on the first portion. COPYRIGHT: (C)2006,JPO&NCIPI |
