| 摘要 |
PROBLEM TO BE SOLVED: To provide a film pasting device that enables a film to be pasted at any semiconductor wafer location with an even line pressure under smooth welding force control. SOLUTION: This device comprises a sliding unit 20 for moving a slider 40 by means of a motor 18, a first slide member 44 connected to the slider 40, and a vertical rail 48 which is relatively fixed for an horizontal guide 22 of the sliding unit 20 and is extended vertically. It also comprises a paste roller 66 for pasting a film material 78 to a semiconductor wafer 76, a roller supporter 60 for supporting the paste roller 66, and a second slide member 56 that engages with the vertical rail 48 fixed at the rear of the roller supporter 60 in a slidable manner. Furthermore, it comprises a slant rail 72 in the roller supporter 60 in such a way that it slants a little in a horizontal direction and the first slide member 44 engages in a slidable manner, and raises or lowers the roller supporter 60 along a slant of the slant rail 72 by means of the motor 18 to control suppress strength to the semiconductor wafer 76 with the paste roller 66. COPYRIGHT: (C)2006,JPO&NCIPI
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