发明名称 |
ELECTRIC CIRCUIT DEVICE AND COOLING STRUCTURE THEREIN |
摘要 |
PROBLEM TO BE SOLVED: To provide an electric circuit device and a cooling structure therein, capable of lowering the temperature of the whole electric circuit device with a simple structure. SOLUTION: In the electric circuit device wherein electronic parts 1 are mounted on a substrate 10, a sheet shaped electric insulating substance 4 with thermal conductivity is laid on the electronic parts, a bus bar 3 with thermal conductivity is provided on this sheet-shaped electric insulating substance. The both ends of this bus bar are characteristically fixed to the substrate in the electric circuit device. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006179628(A) |
申请公布日期 |
2006.07.06 |
申请号 |
JP20040370346 |
申请日期 |
2004.12.22 |
申请人 |
SHINDENGEN ELECTRIC MFG CO LTD |
发明人 |
MARSUDI BUDI UTOMO;OKUBO HIROSHI |
分类号 |
H01L23/36;H05K7/06;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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