发明名称 ELECTRIC CIRCUIT DEVICE AND COOLING STRUCTURE THEREIN
摘要 PROBLEM TO BE SOLVED: To provide an electric circuit device and a cooling structure therein, capable of lowering the temperature of the whole electric circuit device with a simple structure. SOLUTION: In the electric circuit device wherein electronic parts 1 are mounted on a substrate 10, a sheet shaped electric insulating substance 4 with thermal conductivity is laid on the electronic parts, a bus bar 3 with thermal conductivity is provided on this sheet-shaped electric insulating substance. The both ends of this bus bar are characteristically fixed to the substrate in the electric circuit device. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006179628(A) 申请公布日期 2006.07.06
申请号 JP20040370346 申请日期 2004.12.22
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 MARSUDI BUDI UTOMO;OKUBO HIROSHI
分类号 H01L23/36;H05K7/06;H05K7/20 主分类号 H01L23/36
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