| 摘要 |
High frequency conductors can be used with packages of integrated circuits. It includes metal traces on the surface of a semiconductor chip with integrated circuits as well as electrical connections of chips in a stack to an interposer or other interfaces which must comply with requirements for high frequencies such as matched impedance or shielded signal propagation. The invention relates also to high frequency conductors perpendicular to the surface of the semiconductor chip to connect metal traces in different planes and a process for manufacturing such metal traces.
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