ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING STRUCTURE

摘要

In electronic component mounting, an electronic component (5) is mounted by bonding a connecting terminal (5a) of the electronic component on an electrode (2) of a substrate (1) with a solder paste (4) wherein solder particles are mixed in a thermosetting adhesive. The solder paste (4) is supplied to a recessed part (3b) as an adhesion reinforcing part set on the electrode (2) and other parts, and solder printing parts (4A, 4B) are formed, respectively. Then, the electronic component (5) is mounted, and in a status where the connecting terminal (5a) and a main body part (5b) of the electronic component (5) are brought into contact with the solder printing parts (4A, 4B), respectively, heat is applied by reflow. Thus, the connecting terminal (5a) and the electrode (2) are bonded by a solder bonding part (6a), and a second resin reinforcing part (7b) for adhering the main body part (5b) on the substrate (1) is formed by adhesive ingredients of the solder printing part (4B).