发明名称 |
Light irradiating device manufacturing method |
摘要 |
There are provided the steps of preparing a conductive foil and then forming a plurality of conductive paths by forming isolation trenches, which are shallower than a thickness of the conductive foil, in the conductive foil except at least areas serving as the conductive paths, fixing respective photo semiconductor chips (65) to desired conductive paths, molding a light transparent resin (67) serving as a lens to cover respective photo semiconductor chips (65) individually and to fill the isolation trenches, and removing the conductive foil on the side on which the isolation trenches are not provided. Therefore, a light irradiating device (68), in which back surfaces of the conduction paths can be connected to the outside to thus eliminate through holes and which has the good radiation characteristic, can be implemented. |
申请公布号 |
EP1162668(A3) |
申请公布日期 |
2006.07.05 |
申请号 |
EP20010304772 |
申请日期 |
2001.05.31 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
SAKAMOTO, NORIAKI;KOBAYASHI, YOSHIYUKI;MAEHARA, EIJU;TAKAHASHI, KOUJI;SAKAMOTO, JUNJI;MASHIMO, SHIGEAKI;OKAWA, KATSUMI |
分类号 |
H01L25/13;H01L33/48;H01L33/54;H01L33/62 |
主分类号 |
H01L25/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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