发明名称 Phase change memory device having an adhesion layer and manufacturing process thereof
摘要 A memory includes a phase change memory element having a memory layer (350) of a calcogenide material and an adhesion layer (1000,1002,1004,1006,1008,1010) of an alloy of the form Ti a X b N c where X is selected in the group comprising silicon, aluminum, carbon, or boron, and c may be 0. The nitrogen and silicon are adapted to reduce the diffusion of titanium toward the chalcogenide layer.
申请公布号 EP1677357(A1) 申请公布日期 2006.07.05
申请号 EP20040107069 申请日期 2004.12.30
申请人 STMICROELECTRONICS S.R.L. 发明人 CHANG, KUO-WEI;LEE, JONG-WON S.;BESANA, PAOLA
分类号 H01L27/24;H01L45/00 主分类号 H01L27/24
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