| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor encapsulation of an excellent moldability which prevents, on molding, a gold wire deformation, a lead pin deformation and die pad shift as well as molding flash in spite of large amount of a filler used in a manufacture of a thin semiconductor package. SOLUTION: A resin composition for semiconductor encapsulation comprises a thermosetting resin and an inorganic filler. The inorganic filler mainly consists of a silica powder (A) comprising (a1) a super fine silica powder having an average particle size of 0.01-0.5μm and (a2) a silica powder having a circularity of 0.8 or more and an accumulated particle size distribution which satisfies the conditions described below (the total of (1) to (3 is 100 wt.%). 1) Particles of a particle size of 5.0μm or less constitute 5-30 wt.%. (2) Particles of a particle size of 48μm or less constitute 50 wt.% or more. (3) Particles of a particle size of 100μm or more constitute 5 wt.% or less.</p> |
