| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein electrodes for stacking a plurality of semiconductor chips are small while the pitch between electrodes is small to sufficiently cope with a case where multiple signal inputs/outputs are required. SOLUTION: In a through-hole 12 formed at a semiconductor substrate 11, an insulating film 13 protruding above the rear side of the semiconductor substrate 11 is formed, and in the through-hole, an electrode 14 comprising a projection 14A protruding beyond the insulating film 13 on the rear side of the semiconductor substrate 11 is embedded. The conductive electrode material protruding above the rear side of the semiconductor substrate 11 is utilized as a part of a bump, so the electrode is smaller and the pitch between electrodes is small while coping with a case where multiple signal inputs/outputs are required. |
