METHOD OF MANUFACTURING BONDING PAD IN SEMICONDUCTOR CMOS IMAGE SENSOR,申请号KR20040117224-传众专利搜索

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发明名称	METHOD OF MANUFACTURING BONDING PAD IN SEMICONDUCTOR CMOS IMAGE SENSOR
摘要
申请公布号	KR20060077706(A)	申请公布日期	2006.07.05
申请号	KR20040117224	申请日期	2004.12.30
申请人	DONGBU ELECTRONICS CO., LTD.	发明人	HWANG, JOON
分类号	H01L27/146;H01L31/10	主分类号	H01L27/146
代理机构		代理人
主权项
地址

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