Integrated pressure sensor and method of manufacture

摘要

A technique for manufacturing an integrated pressure sensor (150) includes a number of steps. Initially, a substrate (200) with conductive electrical traces located on first and second sides of the substrate (200) is provided. A plurality of compensation circuits (100) are positioned in an array on the first side of the substrate (200) in electrical contact with one or more of the conductive electrical traces on the first side of the substrate (200). A plurality of pressure sensors (10) are positioned on the second side of the substrate (200) in electrical contact with one or more of the conductive electrical traces on the second side of the substrate (200). Each one of the sensors (10) is associated with one of the compensation circuits (100) to form a plurality of pressure sensor-compensation circuit pairs. The substrate (200) includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits (100) provides temperature compensation for an associated one of the sensors (10). The sensor-compensation circuit pairs are calibrated and singulated for final packaging.