发明名称 LIGHT EMITTING DIODE PACKAGE AND PROCESS OF MAKING THE SAME
摘要 <p>A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.</p>
申请公布号 KR20060079070(A) 申请公布日期 2006.07.05
申请号 KR20050073074 申请日期 2005.08.10
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 LIN MING TE;HUANG SHENG PAN;KUO CHIA TAI;CHEN CHIU LING;CHIANG YA HUI;LIN MING YAO
分类号 H01L33/54;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/54
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