| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board having parallel wiring groups intersecting perpendicularly to each other in which switching noise of semiconductor elements is reduced so that the multilayer wiring board can be employed suitably as an electronic circuit board or a package mounting electronic components, e.g. semiconductor elements, operating at a high rate. SOLUTION: On a first insulation layer I1 having a first parallel wiring group L1, a second insulation layer I2 having a second parallel wiring group L2 orthogonal to the first parallel wiring group L1 is formed, and the first and second parallel wiring groups L1, L2 are connected electrically through a through conductor group T, thus producing a multilayer wiring body. The first and second parallel wiring groups L1, L2 have power supply wirings P1, P2 and ground wirings G1, G2, respectively, and facing parts PP, PG having an enlarged width are provided at positions where the power supply wirings P1, P2 intersect the ground wirings G1, G2, thus producing a multilayer wiring board. A required capacitive component can be ensured by the facing parts PP, PG while reducing switching noise. |
