发明名称 |
Semiconductor wafer transport method and apparatus |
摘要 |
A wafer formed thin through a back grinding process is placed on a support table included in an alignment stage. When a faulty suction is caused by a warp of the wafer, a surface of wafer is pressed by a pressing plate to be corrected and held by suction. The wafer held by suction is transported, along with the alignment stage, to a mount frame preparing unit at the next step. The wafer is received while being held by suction by a chuck table contacting the surface of wafer. |
申请公布号 |
EP1320121(A3) |
申请公布日期 |
2006.07.05 |
申请号 |
EP20020026785 |
申请日期 |
2002.12.02 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
YAMAMOTO, MASAYUKI;MATSUSHITA, TAKAO |
分类号 |
B65G49/07;H01L21/00;H01L21/677;H01L21/68;H01L21/683 |
主分类号 |
B65G49/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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