发明名称 HOT-MELT ADHESIVE PROVIDED IN THE FORM OF GRANULATED MATERIAL
摘要 <p>A moisture-curing hot-melt-adhesive composition in granulate, tablet or powder form can be produced by a.) fusing the reactive hot-melt-adhesive composition and heating the melt, subject to exclusion of moisture, b.) extruding this melt through one or more dies onto a cooled surface, subject to exclusion of moisture, c.) cooling the granulate, subject to exclusion of moisture, whereby the composition solidifies, d.) removing the cooled hot-melt-adhesive granulate, e.) filling the granulate into moisture-tight packages, subject to exclusion of moisture. These reactive hot-melt adhesives are pourable and free-flowing and therefore can be used with all conventional application machines for hot-melt adhesives.</p>
申请公布号 EP1397455(B1) 申请公布日期 2006.07.05
申请号 EP20020740538 申请日期 2002.04.30
申请人 HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN 发明人 PRIMKE, HARTMUT;PETRY, GERALD;NIXON, ANDREW;KOHLSTADT, HANS-PETER;SCHEFFLER, INGOLF;WICHELHAUS, JUERGEN;KREBS, MICHAEL;RUDOLF, MICHAEL
分类号 C09J5/06;C09J201/00;B29B9/10;C08G18/12;C08G18/40;C08J3/12;C09J4/00;C09J4/02;C09J5/00;C09J163/00;C09J175/04;C09J201/02;C09J201/10 主分类号 C09J5/06
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