Optoelectronic Module and Method of Making Such a Module

摘要

An optical subassembly (240) for an optoelectronic module (200) uses an optical turn that permits mounting of the OSA (240) on a circuit board (260) of a primary module. A fabrication process for the OSA (240) can achieve low complexity and high yield from the ability to fabricate the OSA (240) separate from fabrication of the primary module. Fabrication of the OSA (240) can include a burn-in test of an optoelectronic chip (210) on a flex circuit (222) that is small to reduce yield loss costs when the optoelectronic chip (210) is defective. The OSA (240) and the primary module can be mechanically attached and electrically connected using wire bonding techniques.