发明名称 COMPOSITION FOR FORMING ETCHING STOPPER LAYER
摘要 An object of the present invention is to provide a composition for formation of etching stopper layer, which can simultaneously realize dry etching selectivity and low permittivity, and a production process of a semiconductor device using the same. This object can be attained by a composition for formation of etching stopper layer, comprising a silicon-containing polymer, the silicon-containing polymer contained in the composition comprising a disilylbenzene structure, and a production process of a semiconductor device comprising forming an etching stopper layer using the composition.
申请公布号 EP1677343(A1) 申请公布日期 2006.07.05
申请号 EP20040787789 申请日期 2004.09.09
申请人 AZ ELECTRONIC MATERIALS USA CORP. 发明人 TASHIRO, YUJI;AOKI, HIROYUKI;ISHIKAWA, TOMONORI
分类号 C08G77/52;C09D183/14;H01L21/311;H01L21/312;H01L21/768;(IPC1-7):H01L21/312;H01L21/306 主分类号 C08G77/52
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