Epoxy-solder thermally conductive structure for an integrated circuit

摘要

A technique for providing a thermally conductive structure for an integrated circuit (IC) chip utilizes a solder and an epoxy. The solder is positioned on at least one of a first side of a heat sink or on a non-active side of the chip. The non-active side of the chip is then positioned adjacent the first side of the heat sink. The epoxy is then positioned around a perimeter of the chip. The epoxy is cured and the solder is reflowed to thermally couple and attach the non-active side of the IC chip to the heat sink.