| 摘要 |
<p>A semiconductor device is disclosed which comprises a substrate (10) having a surface which is provided with a recessed portion and/or projected portion (20), and semiconductor layers (11-13) which are formed on the surface of the substrate (10) and made of a material different from that of the substrate (10). The recessed portion and/or projected portion (20) has a lateral surface which is composed of two or more inclined planes having different inclination angles.</p> |
