| 摘要 |
A band for carrying information including a first band section having a bottom side, a first bonding layer disposed over a significant portion of the bottom side and a circuit, configured to carry information, bonded to the bottom of the first band section. The bonding layer may use adhesive or thermal bonds. The band also includes a second band section having a top side and a bottom side, where the top side is bonded to the bottom side of the first band section such that a continuous portion of the first and second band sections are bonded around the entire circuit. The band further includes a second adhesive layer disposed over a significant portion of the bottom side of the second band section and a release section having a top side, the top side bonded to the bottom side of the second band section.
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