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发明名称
wafer level package and method of fabricating the same
摘要
申请公布号
KR100596764(B1)
申请公布日期
2006.07.04
申请号
KR19990023416
申请日期
1999.06.22
申请人
发明人
分类号
H01L23/12
主分类号
H01L23/12
代理机构
代理人
主权项
地址
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