发明名称 Micro surface mount coil unit
摘要 There is provided a micro surface mount coil unit in which the occurrence of positional shift and poor soldering at the time of soldering of the coil unit is avoided without decreasing the width of a coil winding portion of coil form, and the shock resistance of coil unit is increased. The coil unit 10 has a drum-shaped core 11 in which a coil form part around which a coil wire is wound is arranged between flange parts 13 and 14 and a lead frame 12 bondingly fixed to the lower flange part 14 . The lead frame 12 has left and right lead frame parts 12 A and 12 B bonded to the lower flange part 14 , and the outside surface of a bottom surface 18 of each of the lead frame parts 12 A and 12 B is separated into a first region forming an external connecting terminal 15 and a second region not forming the external connecting terminal 15 by notches 17.
申请公布号 US7071803(B2) 申请公布日期 2006.07.04
申请号 US20040889129 申请日期 2004.07.13
申请人 SUMIDA CORPORATION 发明人 OKI JUICHI
分类号 H01F27/02;H01F27/06;H01F17/04;H01F27/29 主分类号 H01F27/02
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