method for forming wafer level package,申请号KR20040113819-传众专利搜索

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发明名称	method for forming wafer level package
摘要
申请公布号	KR100596797(B1)	申请公布日期	2006.07.04
申请号	KR20040113819	申请日期	2004.12.28
申请人		发明人
分类号	H01L23/12;H01L25/065	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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