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发明名称
METHOD OF REMOVING STI VOID AND IMPROVING ISOLATION LEAKAGE BY STI GAP FILLING
摘要
申请公布号
KR20060075777(A)
申请公布日期
2006.07.04
申请号
KR20040114675
申请日期
2004.12.29
申请人
DONGBU ELECTRONICS CO., LTD.
发明人
OH, MIN JAE
分类号
H01L21/76
主分类号
H01L21/76
代理机构
代理人
主权项
地址
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